The advancement of terahertz integrated circuits holds crucial significance in realizing sixth-generation (6G) wireless communication, high-speed on-chip interconnects, high-resolution imaging, on-chip biosensors, and fingerprint chemical detection. However, current on-chip terahertz devices face challenges such as reflection and scattering losses at sharp bends or defects. Recently discovered topological phases of light impart extraordinary properties to photonics devices, including reflectionless propagation and robustness against impurities or defects. This robustness is essential for terahertz integrated devices. Harnessing the resilience of topological edge states in conjunction with a low-loss silicon platform is poised to deliver outstanding performance in terahertz devices, marking a breakthrough in terahertz integrated circuits and high-speed interconnects.
We aim to develop various terahertz functional devices enabled by a photonic topological insulator. This innovation is expected to pave the way for developing emerging terahertz technologies, essential for advancing the vision of 6G communication.
Schematic of terahertz integrated circuits for emerging applications like 6G communication, sensing and high-resolution imaging.
